Focus on laser-Han's Laser Technology Industry Group Co., Ltd +86-************ international@************* About Us About Us Introduction Plants overview Milestones Global footprints Customer brands Business ethics Incorruption supervision Products Products Laser marking machines Laser cutting machines Laser welding machines Automation Laser generator Semiconductor packaging equipment 3D printers Motor Applications Applications Electronic and semiconductor Mechanical hardware New energy Packaging industry Brittle Material Industry Auto industry PCB Industry Others Service Service Equipment installation Product video Sample test Equipment after-sales News News Press release Annual Event Contact Contact Leave Us a Message Become a Dealer Language 大客户事业部 简体中文 繁體中文 한국어 日本語 ไทย Deutsch Tiếng Việt About Us Introduction Plants overview Milestones Global footprints Customer brands Business ethics Incorruption supervision Products Laser marking machines Laser cutting machines Laser welding machines Automation Laser generator Semiconductor packaging equipment 3D printers Motor Applications Electronic and semiconductor Mechanical hardware New energy Packaging industry Brittle Material Industry Auto industry PCB Industry Others Service Equipment installation Product video Sample test Equipment after-sales News Press release Annual Event Contact Leave Us a Message Become a Dealer Language 大客户事业部 简体中文 繁體中文 한국어 日本語 ไทย Deutsch Tiếng Việt Products Series Laser marking machines Laser cutting machines Laser welding machines Automation Laser generator Semiconductor packaging equipment 3D printers Motor Products HDZ-WUVC100 Applicable for the 2 inch, 4 inch, 8 inch and 12 inch wafers cutting processing More Offline PCBA (FPCBA) Cutting machine HDZ-UVC3030 1. With high-performance UV lase and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With high-precision CCD positioning system. More EP-IRPS-20 1. Cutting and drilling of brittle materials such as glass, sapphire and ceramics. 2. LCD, OLED screen cutting (C, R, U angle cutting). 3. Ultra-precise Mark points on the glass material, fine invisible QR code (0.2mm) and other fine marks. More HDZ-SIC200 Applicable for the packaged IC marking of DIP, QFN and BGA. More Built-in flip PCB marking system HDZ-PCB100F Applicable for the digital products, wearable devices, automobile PCBA, mobile phone PCBA, FPC and so on. Marking on the Rigid and flexible printed circuit board (PCBAs). Support 1D barcodes, 2D Matrix, QR codes, logo, batch number marking. More HDZ-WAF600 Applicable for the 6-inch, 8-inch and 12-inch wafer marking More Automated laser marking machine 1, High precision, precise pick and place, 8 materials flipped, laser marking on 3 sides synchronously. 2, High efficiency, 4 stations linkage, marking time 1.12pcs/s. 3, Strong stability, 99% product yield under high-speed operation. More Gap&Step The machine is mainly used for the Gap & Step inspection for power plugs More Semiconductor laser welder - WFD10/25/50/100/1000 The WFD series is a diode laser that uses diode materials to illuminate between energy bands. Two parallel mirror surfaces inside the diode are formed as a resonant cavity, which illuminates the light, and outputs laser of wavelength 915 nm. With fiber t More HFM-K Series 200-300W Pulse Fiber Laser HFM series is a series of pulse fiber laser independently developed by Han's Laser and designed with MOPA scheme. More Large format PCBA laser marking system HDZ-PCB6565AL More Online PCBA/FPCBA laser cutting machine HDZ-CL4030 Product Characteristics 1. With high-performance UV laser and self-developed control software. 2. With the high-precision motion platform system and high-precision galvanometer scanner. 3. With high-precision CCD positioning system. More Ultrafast Glass Cutting and Drilling Machine HDZ-GCF3000 1、Glass thickness: 0.1-1.2mm 2、Edge breakage size: ＜0.005mm 3、Processing speed: 4s/pcs, 115*60mm, R5mm,DOL
