长电科技集团

JCET Group —— Home Technology & Solutions Turnkey Services Design Packaging Wirebond Packaging Flip Chip Packaging Wafer Bumping Wafer Level Packaging System-in-Package MEMS and Sensors Packaging Power Device Packaging Advancement of Mainstream Package Test Applications Automotive Computing Storage Edge AI Power & Energy About JCET Company Information Worldwide Locations Corporate Culture Leadership Team Environmental Social & Governance Quality Management Conflict-Free Minerals Policy Contact Us Investor Relations Financial Reports News Careers English 中文 Home Technical&Solutions Turnkey Design Packaging Wirebond Packaging Flip Chip Packaging Wafer Bumping Wafer Level Packaging System-in-Package MEMS and Sensors Packaging Power Device Packaging Advancement of Mainstream Package Test Others 晶圆凸块 可靠性试验与失效分析 Applications Automotive Computing Storage Edge AI Power & Energy About JCET Company Information Worldwide Locations Corporate Culture Leadership Team Management Team Environmental, Social & Governance Quality Management Conflict-Free Minerals Policy Contact Us Investor Relations Financial Reports News Careers    English 中文 Advanced Packaging - Connecting Technologies JCET Opens Shanghai Zhangjiang R&D Building to Strengthen Innovation Capabilities Read more JCET Hosts Advanced Packaging Developer Conference Focused on Robotics and Automotive Chips Read more JCET Shanghai Automotive Co., Ltd. Officially Commences Operations, Setting New Benchmark for Automotive and Robotics Semiconductor Backend Manufacturing Read more JCET Delivers Silicon Photonics Engine Samples, Marks CPO Milestone Read more JCET Posts Record Q3 Revenue, Profit Before Tax Up 29.3% Year-on-Year Read more About JCET Founded in 1972, JCET Group is the world's leading integrated circuit manufacturing and technology services provider. JCET is a global company that serves the world through our rich technology patent portfolio, our eight-site manufacturing powerhouse, and our dedicated teams around the globe.   Learn more JCET Data Sustainability is a core management principle at JCET. We weave it into our operating standards, emphasizing regulatory compliance, continuous innovation, green development, responsible procurement, employee well-being, and open collaboration to reinforce our ESG framework. Global No.3 and China’s Mainland No.1 OSAT. Over 50 years of IC packaging and testing experience 8 manufacturing Campuses and 20 + business offices worldwide 3,000+ Global Patents ~20,000 Employees Worldwide Applications Beyond the traditional OSAT model, we delve deep into customer needs to deliver focused, product-specific IC back-end manufacturing solutions. Learn more Automotive Computing Storage Edge AI Power & Energy Technology solutions编辑背景视频 Turnkey Services JCET delivers world-class services to its customers. The greatest value from doing business with JCET is realized when engaging JCET as a full turnkey solutions provider–from IC design through test program development, wafer bump, wafer probe, multi-die stacked assembly, final test, packaging, and shipment to end customers. Learn more Design As the electronics industry moves towards more complex semiconductor packages that are smaller, faster, and higher performance, engineers are faced with the challenge of trying to fit more powerful components into a smaller area without causing long-term reliability issues or stress on a package. Delivering the optimum package design requires an in-depth analysis of key package measurements and simulation. Learn more Packaging Services JCET offers a full suite of assembly services to meet our customers’ semiconductor packaging needs, including leadframe, laminate, flip chip interconnect, and advanced wafer level technology. Learn more Test Services Semiconductor chips are rapidly increasing in complexity, requiring more advanced test systems and capabilities. JCET provides customers with a full suite of test platforms and engineering services to support a broad range of mixed signal, Radio Frequency (RF), analog, and high-performance digital semiconductor devices. Learn more News All News Company News 2026-03-13 JCET Opens Shanghai Zhangjiang R&D Building to Strengthen Innovation Capabilities Company News 2026-03-12 JCET Hosts Advanced Packaging Developer Conference Focused on Robotics and Automotive Chips Company News 2026-03-11 JCET Shanghai Automotive Co., Ltd. Officially Commences Operations, Setting New Benchmark for Automotive and Robotics Semiconductor Backend Manufacturing Careers Learn more ESG Learn more Worldwide Locations Learn more Technology & solutions Turnkey Services Design Packaging Test Applications Automotive Computing Storage Edge AI Power & Energy About JCET Company Information Worldwide Locations Corporate Culture Leadership Team Environmental Social & Governance Quality Management Conflict-Free Minerals Policy Contact Us Investor Relations Financial Reports News Careers Legal Notices 版权所有@江苏长电科技股份有限公司 保留一切权利 苏ICP备05082751号-1 32028102000607 Share: